Invention Grant
- Patent Title: Electronic device comprising bonding layer in contact with active area of digitizer
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Application No.: US17833107Application Date: 2022-06-06
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Publication No.: US11893196B2Publication Date: 2024-02-06
- Inventor: Jeonggyu Jo , Jungchul An , Byunghoon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR 20210067753 2021.05.26
- Main IPC: G06F3/046
- IPC: G06F3/046 ; B32B7/12 ; B32B3/30

Abstract:
An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.
Public/Granted literature
- US20220382399A1 ELECTRONIC DEVICE USING COMPRISING BONDING LAYER IN CONTACT WITH ACTIVE AREA OF DIGITIZER Public/Granted day:2022-12-01
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