Invention Grant
- Patent Title: System to optimize voltage distribution along high voltage doubler string
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Application No.: US17159658Application Date: 2021-01-27
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Publication No.: US11894175B2Publication Date: 2024-02-06
- Inventor: Vasu Mogaveera
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: NIELDS, LEMACK & FRAME, LLC.
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/26 ; H01F27/40 ; H05K1/02

Abstract:
A high voltage power supply is disclosed. The high voltage power supply comprises a primary winding and one or more secondary windings. In one embodiment, a single secondary winding is used and the high voltage doubler circuit comprises a capacitor string and a diode string. In another embodiment, a plurality of secondary windings are used and the high voltage doubler circuit comprises a plurality of low voltage doubler circuits arranged in series. To create a more uniform distribution of voltage across the capacitors in the high voltage doubler circuit, one or more shields are disposed on the printed circuit board. In certain embodiments, a high voltage shield is disposed at the high voltage output and a low voltage shield is disposed at the low voltage end of the high voltage doubler circuit. One or more intermediate shields may be disposed in the high voltage doubler circuit.
Public/Granted literature
- US20220238269A1 System To Optimize Voltage Distribution Along High Voltage Doubler String Public/Granted day:2022-07-28
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