Invention Grant
- Patent Title: Electrostatic chuck, support platform, and plasma processing apparatus
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Application No.: US16891425Application Date: 2020-06-03
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Publication No.: US11894218B2Publication Date: 2024-02-06
- Inventor: Masato Takayama , Yasuharu Sasaki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 19105704 2019.06.05
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H02N13/00

Abstract:
There is provision of an electrostatic chuck for supporting a substrate and an edge ring including a first region, a second region, an electrode provided in the second region, and an elastic member. The first region includes a first top surface and is configured to hold the substrate that is placed on the first top surface. The second region extends in a circumferential direction of the first region so as to surround the first region. The second region includes a second top surface, and is configured to support the edge ring placed on the second top surface. The first top surface and the second top surface extend along a single flat plane. A part of the edge ring is accommodated in a space provided between the first region and the second region, and the elastic member is disposed between the part of the edge ring and the electrostatic chuck.
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