Invention Grant
- Patent Title: Non-planar semiconductor packaging systems and related methods
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Application No.: US16862294Application Date: 2020-04-29
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Publication No.: US11894245B2Publication Date: 2024-02-06
- Inventor: Michael J. Seddon , Francis J. Carney
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Adam R. Stephenson, LTD.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B21D11/10 ; H01L21/02
Abstract:
Implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.
Public/Granted literature
- US20210343555A1 NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS Public/Granted day:2021-11-04
Information query
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