Invention Grant
- Patent Title: Substrate holding mechanism, substrate mounting method, and substrate detaching method
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Application No.: US17453208Application Date: 2021-11-02
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Publication No.: US11894256B2Publication Date: 2024-02-06
- Inventor: Toshiaki Takahara , Fumito Kagami
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 20190285 2020.11.16
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683

Abstract:
A substrate holding mechanism includes: a mounting stage on which a substrate is mounted; a plurality of holding sections each of which includes an upper surface that holds a lower surface of a peripheral section of the substrate and includes a lower surface that pushes down an upper surface of the peripheral section of the substrate mounted on the mounting stage; a protrusion that is provided on the plurality of holding sections and that contacts an end surface of the substrate mounted on the mounting stage to correct a position of the substrate; a lifting and lowering mechanism configured to lift and lower the plurality of holding sections; and a horizontal moving mechanism configured to horizontally move the plurality of holding sections.
Public/Granted literature
- US20220157641A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE MOUNTING METHOD, AND SUBSTRATE DETACHING METHOD Public/Granted day:2022-05-19
Information query
IPC分类: