Invention Grant
- Patent Title: Local interconnect
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Application No.: US17496414Application Date: 2021-10-07
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Publication No.: US11894263B2Publication Date: 2024-02-06
- Inventor: Cheng-Hsien Wu , Chung-Yi Lin , Yen-Sen Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L23/535

Abstract:
Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first metal line extending along a first direction, a second metal line lengthwise aligned with and spaced apart from the first metal line, and a third metal line extending along the first direction. The third metal line includes a branch extending along a second direction perpendicular to the first direction and the branch partially extends between the first metal line and the second metal line.
Public/Granted literature
- US20230011752A1 LOCAL INTERCONNECT Public/Granted day:2023-01-12
Information query
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