Invention Grant
- Patent Title: Semiconductor power module with busbar having a leg with a foot forming an offset angle, and method for manufacturing the busbar
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Application No.: US16982911Application Date: 2019-03-18
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Publication No.: US11894302B2Publication Date: 2024-02-06
- Inventor: Michael Tønnes
- Applicant: Danfoss Silicon Power GmbH
- Applicant Address: DE Flensburg
- Assignee: Danfoss Silicon Power GmbH
- Current Assignee: Danfoss Silicon Power GmbH
- Current Assignee Address: DE Flensburg
- Agency: McCormick, Paulding & Huber PLLC
- Priority: DE 2018204408.2 2018.03.22
- International Application: PCT/EP2019/056729 2019.03.18
- International Announcement: WO2019/179955A 2019.09.26
- Date entered country: 2020-09-21
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/13 ; H01L25/07

Abstract:
A conducting busbar (2, 4) suitable for use in a semiconductor power module (8) is provided. The busbar (2, 4) comprises a main plate (210, 410), one or more legs (220, 420) extending from the main plate (210, 410), and one or more feet (230, 430) formed at the free end of the legs (220, 420). According to the invention, the intersection line (L) between at least one of the legs (220, 420) and the associated foot (230, 430) forms an offset angle (α) with respect to the longitudinal direction (X) of the main plate (210, 410).
Public/Granted literature
- US20210013148A1 BUSBAR, METHOD FOR MANUFACTURING THE SAME AND POWER MODULE COMPRISING THE SAME Public/Granted day:2021-01-14
Information query
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