Invention Grant
- Patent Title: Circuit wiring techniques for stacked transistor structures
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Application No.: US17130164Application Date: 2020-12-22
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Publication No.: US11894303B2Publication Date: 2024-02-06
- Inventor: Dongbing Shao , Chen Zhang , Zheng Xu , Tenko Yamashita
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Daniel Yeates
- The original application number of the division: US16296502 2019.03.08
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/822 ; H01L23/50 ; H01L27/092 ; H01L21/8238 ; H01L21/8234 ; H10B41/20 ; H10B51/20

Abstract:
A semiconductor structure includes a three-dimensional stacked transistor structure including first and second field-effect transistors of a first type at a first vertical level and third and fourth field-effect transistors of a second type at a second vertical level disposed over the first vertical level. The semiconductor structure also includes a first gate structure shared between the first and second field-effect transistors at the first vertical level, a second gate structure shared between the third and fourth field-effect transistors at the second vertical level, and a gate contact shared by the first and second gate structures. The wherein the first and second gate structures are vertically aligned with another in a layout of the three-dimensional stacked transistor structure between source drain/regions of the first, second, third and fourth field-effect transistors.
Public/Granted literature
- US20210111121A1 CIRCUIT WIRING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES Public/Granted day:2021-04-15
Information query
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