A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a semiconductor device, a ring structure, a lid structure, and an adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed over the substrate and surrounds the semiconductor device. The lid structure is disposed over the ring structure and extends across the semiconductor device. The adhesive member is disposed in a gap between the ring structure and the semiconductor device and attached to the lid structure and the substrate.