Invention Grant
- Patent Title: Apparatus including integrated segments and methods of manufacturing the same
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Application No.: US17405604Application Date: 2021-08-18
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Publication No.: US11894327B2Publication Date: 2024-02-06
- Inventor: Wei Zhou , Chien Wen Huang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L23/00 ; H01L23/36
Abstract:
Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.
Public/Granted literature
- US20230054514A1 APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2023-02-23
Information query
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