Invention Grant
- Patent Title: Dual head capillary design for vertical wire bond
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Application No.: US16160212Application Date: 2018-10-15
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Publication No.: US11894334B2Publication Date: 2024-02-06
- Inventor: Yuhong Cai , Bilal Khalaf , Yi Xu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065
Abstract:
Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.
Information query
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