Invention Grant
- Patent Title: Power semiconductor device
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Application No.: US17439048Application Date: 2020-01-30
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Publication No.: US11894348B2Publication Date: 2024-02-06
- Inventor: Hironori Nagasaki , Toru Kato , Takashi Hirao , Shintaro Tanaka
- Applicant: Hitachi Astemo, Ltd.
- Applicant Address: JP Hitachinaka
- Assignee: Hitachi Astemo, Ltd.
- Current Assignee: Hitachi Astemo, Ltd.
- Current Assignee Address: JP Hitachinaka
- Agency: Foley & Lardner LLP
- Priority: JP 19062196 2019.03.28
- International Application: PCT/JP2020/003314 2020.01.30
- International Announcement: WO2020/195140A 2020.10.01
- Date entered country: 2021-09-14
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L23/538 ; H01L23/00 ; H01L25/00

Abstract:
A power semiconductor device includes a first submodule including a first power semiconductor element, a second submodule including a second power semiconductor element, a positive electrode side conductor portion and a negative electrode side conductor portion, an intermediate substrate that forms a negative electrode side facing portion facing the negative electrode side conductor portion with the first submodule sandwiched between them and a positive electrode side facing portion facing the positive electrode side conductor portion with the second submodule sandwiched between them, and a plurality of signal terminals that transmit a signal for controlling the first power semiconductor element or the second power semiconductor element. The second submodule is disposed such that directions of an electrode surface of the second power semiconductor element and an electrode surface of the first power semiconductor element are inverted, a signal relay conductor portion is disposed in a space sandwiched between a part of the second submodule and the intermediate substrate in a height direction of the second submodule, and the intermediate substrate has a wire connected to the signal relay conductor portion and electrically connected to the signal terminal. In this manner, productivity of the power semiconductor device is improved while an increase in main circuit inductance is suppressed.
Public/Granted literature
- US20220157788A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2022-05-19
Information query
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