Invention Grant
- Patent Title: Co-integrated logic, electrostatic discharge, and well contact devices on a substrate
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Application No.: US17545501Application Date: 2021-12-08
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Publication No.: US11894361B2Publication Date: 2024-02-06
- Inventor: Julien Frougier , Sagarika Mukesh , Anthony I. Chou , Andrew M. Greene , Ruilong Xie , Veeraraghavan S. Basker , Junli Wang , Effendi Leobandung , Jingyun Zhang , Nicolas Loubet
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent L. Jeffrey Kelly
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/8234 ; H01L21/84 ; H01L27/12

Abstract:
A semiconductor device is provided. The semiconductor device includes a first field effect device on a first region of a substrate, wherein a first gate structure and an electrostatic discharge device on a second region of the substrate, wherein a second gate structure for the electrostatic discharge device is separated from the substrate by the bottom dielectric layer, and a second source/drain for the electrostatic discharge device is in electrical contact with the substrate, wherein the second source/drain is doped with a second dopant type.
Public/Granted literature
- US20230178539A1 CO-INTEGRATED LOGIC, ELECTROSTATIC DISCHARGE, AND WELL CONTACT DEVICES ON A SUBSTRATE Public/Granted day:2023-06-08
Information query
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