Invention Grant
- Patent Title: Integrated circuit devices
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Application No.: US17871077Application Date: 2022-07-22
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Publication No.: US11894371B2Publication Date: 2024-02-06
- Inventor: Dongchan Suh , Dahye Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190063309 2019.05.29
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/78

Abstract:
Provided is an integrated circuit device including: a plurality of fin-type active regions protruding from a top surface of a substrate and extending in a first horizontal direction; at least one semiconductor layer, each including a lower semiconductor layer and an upper semiconductor layer sequentially stacked on at least one of the plurality of fin-type active regions; and a plurality of gate electrodes extending in a second horizontal direction crossing the first horizontal direction on the plurality of fin-type active regions, wherein the lower semiconductor layer includes a same material as a material of the upper semiconductor layer, and wherein a semiconductor interface is provided between the lower semiconductor layer and the upper semiconductor layer.
Public/Granted literature
- US20220359507A1 INTEGRATED CIRCUIT DEVICES Public/Granted day:2022-11-10
Information query
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