Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US17648314Application Date: 2022-01-19
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Publication No.: US11894374B2Publication Date: 2024-02-06
- Inventor: Wenli Zhao , Jie Bai
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2110813115.2 2021.07.19
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238

Abstract:
The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, an NMOS transistor, and a PMOS transistor. The NMOS transistor includes a first dielectric layer, a first work function layer, and a first conductive layer that are stacked in sequence. The PMOS transistor includes a second dielectric layer, a second work function layer, and a second conductive layer that are stacked in sequence.
Public/Granted literature
- US20230015200A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-01-19
Information query
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