Invention Grant
- Patent Title: Gate-controlled diode and chip
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Application No.: US17208492Application Date: 2021-03-22
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Publication No.: US11894422B2Publication Date: 2024-02-06
- Inventor: Wei Li
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: HAUPTMAN HAM, LLP
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/24 ; H01L29/06 ; H01L29/66 ; H01L29/423 ; H01L29/417

Abstract:
A gate-controlled diode includes a substrate, a gate stacked on the substrate, a gate insulation layer, a first two-dimensional semiconductor layer, a second two-dimensional semiconductor layer, a source, and a drain disposed separately from the source. The gate is embedded in a surface of the substrate, and the gate insulation layer covers the surface of the substrate in which the gate is disposed. The first two-dimensional semiconductor layer is stacked on the gate insulation layer, a portion of the second two-dimensional semiconductor layer is stacked on the gate insulation layer, another portion is stacked on the first two-dimensional semiconductor layer. The another portion of the second two-dimensional semiconductor layer stacked on the first two-dimensional semiconductor layer forms a heterojunction. An orthographic projection of the heterojunction onto the substrate is in an orthographic projection of the gate onto the substrate.
Public/Granted literature
- US20210226046A1 GATE-CONTROLLED DIODE AND CHIP Public/Granted day:2021-07-22
Information query
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