Invention Grant
- Patent Title: Semiconductor arrangement and method of manufacture
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Application No.: US18106001Application Date: 2023-02-06
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Publication No.: US11894425B2Publication Date: 2024-02-06
- Inventor: Yun-Chi Wu , Tsung-Yu Yang , Cheng-Bo Shu , Chien Hung Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: COOPER LEGAL GROUP, LLC
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/40 ; H01L21/3213 ; H01L21/265 ; H01L21/266 ; H01L21/311 ; H01L29/66 ; H01L21/027 ; H01L21/8238 ; H01L29/78 ; H01L27/092 ; H01L21/02 ; H10B10/00

Abstract:
A method of forming a semiconductor arrangement includes forming a gate dielectric layer over a semiconductor layer. A gate electrode layer is formed over the gate dielectric layer. A first gate mask is formed over the gate electrode layer. The gate electrode layer is etched using the first gate mask as an etch template to form a first gate electrode. A first dopant is implanted into the semiconductor layer using the first gate mask and the first gate electrode as an implantation template to form a first doped region in the semiconductor layer.
Public/Granted literature
- US20230187499A1 SEMICONDUCTOR ARRANGEMENT AND METHOD OF MANUFACTURE Public/Granted day:2023-06-15
Information query
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