Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17955526Application Date: 2022-09-28
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Publication No.: US11894434B2Publication Date: 2024-02-06
- Inventor: Po-Yu Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2011384166.X 2020.12.01
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/417 ; H01L29/40 ; H01L29/778 ; H01L29/66

Abstract:
A semiconductor device includes a substrate, a semiconductor channel layer, a semiconductor barrier layer, a gate electrode, a first electrode, and a dielectric layer. The semiconductor channel layer is disposed on the substrate, and the semiconductor barrier layer is disposed on the semiconductor channel layer. The gate electrode is disposed on the semiconductor barrier layer. The first electrode is disposed at one side of the gate electrode. The first electrode includes a body portion and a vertical extension portion. The body portion is electrically connected to the semiconductor barrier layer, and the bottom surface of the vertical extension portion is lower than the top surface of the semiconductor channel layer. The dielectric layer is disposed between the vertical extension portion and the semiconductor channel layer. The first electrode is a conformal layer covers the semiconductor barrier layer and the dielectric layer.
Public/Granted literature
- US20230024802A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2023-01-26
Information query
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