Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
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Application No.: US17306725Application Date: 2021-05-03
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Publication No.: US11894446B2Publication Date: 2024-02-06
- Inventor: Ling-Yen Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT, PC
- The original application number of the division: US16203378 2018.11.28
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L21/308 ; H01L21/311 ; H01L21/306 ; H01L21/02

Abstract:
In a method of manufacturing a semiconductor device, a fin structure is formed over a substrate. The fin structure is sculpted to have a plurality of non-etched portions and a plurality of etched portions having a narrower width than the plurality of non-etched portions. The sculpted fin structure is oxidized so that a plurality of nanowires are formed in the plurality of non-etched portions, respectively, and the plurality of etched portions are oxidized to form oxides. The plurality of nanowires are released by removing the oxides.
Public/Granted literature
- US20210273081A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2021-09-02
Information query
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