Invention Grant
- Patent Title: Dipoles in semiconductor devices
-
Application No.: US17537339Application Date: 2021-11-29
-
Publication No.: US11894461B2Publication Date: 2024-02-06
- Inventor: Hsiang-Pi Chang , Yen-Tien Tung , Dawei Heh , Chung-Liang Cheng , I-Ming Chang , Yao-Sheng Huang , Tzer-Min Shen , Huang-Lin Chao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/51 ; H01L29/66 ; H01L29/40

Abstract:
A semiconductor device includes a semiconductor substrate, an interfacial layer formed on the semiconductor substrate, a high-k dielectric layer formed on the interfacial layer, and a conductive gate electrode layer formed on the high-k dielectric layer. At least one of the high-k dielectric layer and the interfacial layer is doped with: a first dopant species, a second dopant species, and a third dopant species. The first dopant species and the second dopant species form a plurality of first dipole elements having a first polarity. The third dopant species forms a plurality of second dipole elements having a second polarity, and the first and second polarities are opposite.
Public/Granted literature
- US20220310846A1 DIPOLES IN SEMICONDUCTOR DEVICES Public/Granted day:2022-09-29
Information query
IPC分类: