Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US17978269Application Date: 2022-11-01
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Publication No.: US11894486B2Publication Date: 2024-02-06
- Inventor: Shunpei Yamazaki , Miyuki Hosoba , Suzunosuke Hiraishi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP 09270784 2009.11.27
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/12 ; H01L29/786 ; G02F1/1368 ; H10K59/121

Abstract:
Disclosed is a semiconductor device comprising a thin film transistor and wirings connected to the thin film transistor, in which the thin film transistor has a channel formation region in an oxide semiconductor layer, and a copper metal is used for at least one of a gate electrode, a source electrode, a drain electrode, a gate wiring, a source wiring, and a drain wiring. The extremely low off current of the transistor with the oxide semiconductor layer contributes to reduction in power consumption of the semiconductor device. Additionally, the use of the copper metal allows the combination of the semiconductor device with a display element to provide a display device with high display quality and negligible defects, which results from the low electrical resistance of the wirings and electrodes formed with the copper metal.
Public/Granted literature
- US20230057493A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-02-23
Information query
IPC分类: