Invention Grant
- Patent Title: High frequency filter
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Application No.: US17753556Application Date: 2020-09-14
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Publication No.: US11894592B2Publication Date: 2024-02-06
- Inventor: Seiki Chiba , Mikio Waki , Keisuke Oguma , Shinji Ozawa
- Applicant: Seiki Chiba , Mikio Waki , ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Selki Chiba,Mikio Waki,ZEON CORPORATION
- Current Assignee: Selki Chiba,Mikio Waki,ZEON CORPORATION
- Current Assignee Address: JP Tokyo; JP Sakura; JP Tokyo
- Agency: KENJA IP LAW PC
- Priority: JP 19167328 2019.09.13
- International Application: PCT/JP2020/034638 2020.09.14
- International Announcement: WO2021/049666A 2021.03.18
- Date entered country: 2022-03-08
- Main IPC: H01P1/20
- IPC: H01P1/20 ; H01P1/205 ; H01P7/04 ; H01P1/22

Abstract:
A high frequency filter A1 has frequency characteristics such that the amount of attenuation for an input electrical signal is smaller in a first frequency band f1 than in a second frequency band f2. The high frequency filter A1 is provided with a dielectric elastomer transducer 1 that includes a dielectric elastomer layer 13 and a pair of electrode layers 14 sandwiching the dielectric elastomer layer 13. The frequency characteristics are variable by the dielectric elastomer transducer 1. This configuration provides a high frequency filter having frequency characteristics that are variable and suitable for a lightweight and compact configuration.
Public/Granted literature
- US20220336938A1 HIGH FREQUENCY FILTER Public/Granted day:2022-10-20
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