Invention Grant
- Patent Title: Directional coupler and electronic component module
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Application No.: US17028320Application Date: 2020-09-22
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Publication No.: US11894597B2Publication Date: 2024-02-06
- Inventor: Daisuke Tokuda , Yasushi Shigeno
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 19176322 2019.09.27
- Main IPC: H01P5/18
- IPC: H01P5/18 ; H05K1/02 ; H01P3/08

Abstract:
A directional coupler includes a substrate, a main line 121, a main line 122, and a sub-line. The main line 121 and the main line 122 each include a conductor pattern formed in the substrate, and are connected in parallel to each other. The sub-line includes a conductor pattern formed in the substrate. The sub-line is disposed at a position at least partially overlapping with the main line 121 in a plan view of the substrate.
Public/Granted literature
- US20210098854A1 DIRECTIONAL COUPLER AND ELECTRONIC COMPONENT MODULE Public/Granted day:2021-04-01
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