Invention Grant
- Patent Title: Millimeter-wave radar package module
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Application No.: US17206440Application Date: 2021-03-19
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Publication No.: US11894601B2Publication Date: 2024-02-06
- Inventor: Zongming Duan , Chuanming Zhu , Ying Liu , Bowen Wu , Weiwei Jin , Bingfei Dou , Yuefei Dai
- Applicant: 38TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Applicant Address: CN Anhui
- Assignee: 8TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Current Assignee: 8TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Current Assignee Address: CN Hefei
- Priority: CN 2110127024.3 2021.01.29
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; G01S7/03 ; H01Q21/00 ; G01S7/02

Abstract:
Provided is a millimeter-wave radar package module, which relates to antenna packaging. The millimeter wave radar package module includes a package and a plurality of antenna units packaged therein. The package includes a chip, and the chip includes a transmitter and a receiver. The antenna units are respectively connected to an output pin of the receiver and an output pin of the transmitter through a transmission line.
Public/Granted literature
- US20220247066A1 MILLIMETER-WAVE RADAR PACKAGE MODULE Public/Granted day:2022-08-04
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