Invention Grant
- Patent Title: Selective bundling techniques for HARQ-ACK feedback
-
Application No.: US17313782Application Date: 2021-05-06
-
Publication No.: US11894931B2Publication Date: 2024-02-06
- Inventor: Yi Huang , Wanshi Chen , Jing Lei , Huilin Xu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Shumaker & Sieffert, PA
- Main IPC: H04W28/06
- IPC: H04W28/06 ; H04L1/1812 ; H04L1/1867 ; H04L1/1829

Abstract:
Apparatus, methods, and computer-readable media for managing HARQ-ACK processes in wireless user equipment (UEs) allow selective compression of HARQ-ACK information within HARQ-ACK codebooks. A wireless base station may transmit control information including scheduling information for K downlink transport blocks for a UE, and may signal bundling rules for selectively compressing an original HARQ-ACK codebook of size K into a constrained HARQ-ACK codebook of size N
Public/Granted literature
- US20210351876A1 SELECTIVE BUNDLING TECHNIQUES FOR HARQ-ACK FEEDBACK Public/Granted day:2021-11-11
Information query