Invention Grant
- Patent Title: Induction heating apparatus
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Application No.: US17192239Application Date: 2021-03-04
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Publication No.: US11895759B2Publication Date: 2024-02-06
- Inventor: Masashi Sasagawa , Masaki Ono , Masayuki Otawara , Nobuharu Nishikoori , Taro Yoshida , Tomoyuki Kanagawa , Yutaka Yagi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: JP 20047466 2020.03.18 KR 20200187185 2020.12.30
- Main IPC: H05B6/08
- IPC: H05B6/08 ; H05B6/12

Abstract:
An induction heating apparatus is provided. The induction heating apparatus includes a heating coil configured to heat an object to be heated, a full-bridge type inverter configured to supply power to the heating coil, a capacitor provided between an intermediate node of one arm of the inverter and one end of the heating coil, and a first relay provided between the intermediate node and the other end of the heating coil 30. An intermediate node of the other arm of the inverter and an intermediate point of the heating coil are connected through a first wire. The induction heating apparatus includes a processor configured to open or close the first relay based on an impedance of the object to be heated.
Public/Granted literature
- US20210298134A1 INDUCTION HEATING APPARATUS Public/Granted day:2021-09-23
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