Invention Grant
- Patent Title: Methods used in forming a memory array comprising strings of memory cells
-
Application No.: US17674478Application Date: 2022-02-17
-
Publication No.: US11895834B2Publication Date: 2024-02-06
- Inventor: Jiewei Chen , Jordan D. Greenlee , Mithun Kumar Ramasahayam , Nancy M. Lomeli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H10B41/10
- IPC: H10B41/10 ; G11C16/04 ; H10B41/27 ; H10B43/10 ; H10B43/27 ; H10B41/35 ; H10B43/35

Abstract:
A method used in forming a memory array comprising strings of memory cells comprises forming memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Channel-material strings extend through the insulative tiers and the conductive tiers. Horizontally-elongated trenches are between immediately-laterally-adjacent of the memory blocks. Conductor material is in and extends elevationally along sidewalls of the trenches laterally-over the conductive tiers and the insulative tiers and directly electrically couples together conducting material of individual of the conductive tiers. The conductor material is exposed to oxidizing conditions to form an insulative oxide laterally-through the conductor material laterally-over individual of the insulative tiers to separate the conducting material of the individual conductive tiers from being directly electrically coupled together by the conductor material. Additional embodiments are disclosed.
Public/Granted literature
- US20230209818A1 Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells Public/Granted day:2023-06-29
Information query