Invention Grant
- Patent Title: Semiconductor storage device and method of manufacturing semiconductor storage device
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Application No.: US17675826Application Date: 2022-02-18
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Publication No.: US11895839B2Publication Date: 2024-02-06
- Inventor: Hideto Takekida
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 21139106 2021.08.27
- Main IPC: H10B43/27
- IPC: H10B43/27 ; G11C16/34 ; G11C16/26 ; G11C16/10 ; H10B41/27 ; G11C16/04 ; H10B41/35 ; H10B43/35

Abstract:
A semiconductor storage device includes a stack, a channel layer, a first charge storage portion, and a second charge storage portion. The stack includes a plurality of conductive layers and a plurality of insulating layers, and the plurality of conductive layers and the plurality of insulating layers are alternately stacked one by one in a first direction. The channel layer extends in the first direction in the stack. The first charge storage portion is provided between the channel layer and each of the plurality of conductive layers in a second direction intersecting with the first direction. The second charge storage portion includes a portion interposed between two adjacent conductive layers in the plurality of conductive layers in the first direction.
Public/Granted literature
- US20230062309A1 SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE Public/Granted day:2023-03-02
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