Invention Grant
- Patent Title: Memory device and method for manufacturing the same, and electronic apparatus including the memory device
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Application No.: US17309222Application Date: 2018-12-13
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Publication No.: US11895845B2Publication Date: 2024-02-06
- Inventor: Huilong Zhu
- Applicant: Institute of Microelectronics, Chinese Academy of Sciences
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: CN 1811336212.1 2018.11.09
- International Application: PCT/CN2018/120889 2018.12.13
- International Announcement: WO2020/093519A 2020.05.14
- Date entered country: 2021-05-07
- Main IPC: H10B51/20
- IPC: H10B51/20 ; H01L21/28 ; H10B43/27

Abstract:
A memory device and a method for manufacturing the same, and an electronic apparatus including the memory device are provided. The memory device may include: a substrate (1001); an electrode structure on the substrate (1001), in which the electrode structure includes a plurality of first electrode layers and a plurality of second electrode layers that are alternately stacked; a plurality of vertical active regions penetrating the electrode structure; a first gate dielectric layer and a second gate dielectric layer, in which the first gate dielectric layer is between the vertical active region and each first electrode layer of the electrode structure, and the second gate dielectric layer is between the vertical active region and each second electrode layer of the electrode structure, each of the first gate dielectric layer and the second gate dielectric layer constitutes a data memory structure. A first effective work function of a combination of the first electrode layer and the first gate dielectric layer is different from a second effective work function of a combination of the second electrode layer and the second gate dielectric layer.
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