Invention Grant
- Patent Title: Memory device and method of forming the same
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Application No.: US17882845Application Date: 2022-08-08
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Publication No.: US11895849B2Publication Date: 2024-02-06
- Inventor: Chao-I Wu , Yu-Ming Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- The original application number of the division: US17123925 2020.12.16
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00 ; H10B63/00 ; H01L29/78 ; H01L23/522 ; G11C7/18 ; G11C8/14 ; H10N70/00 ; H10N70/20

Abstract:
A memory device and method of forming the same are provided. The memory device includes a first memory cell disposed over a substrate. The first memory cell includes a transistor and a data storage structure coupled to the transistor. The transistor includes a gate pillar structure, a channel layer laterally wrapping around the gate pillar structure, a source electrode surrounding the channel layer, and a drain electrode surrounding the channel layer. The drain electrode is separated from the source electrode a dielectric layer therebetween. The data storage structure includes a data storage layer surrounding the channel layer and sandwiched between a first electrode and a second electrode. The drain electrode of the transistor and the first electrode of the data storage structure share a common conductive layer.
Public/Granted literature
- US20220384525A1 MEMORY DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2022-12-01
Information query
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