Invention Grant
- Patent Title: Transient liquid phase bonding of surface coatings and metal-covered materials
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Application No.: US17185372Application Date: 2021-02-25
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Publication No.: US11897051B2Publication Date: 2024-02-13
- Inventor: Grant O. Cook, III
- Applicant: RTX Corporation
- Applicant Address: US CT Farmington
- Assignee: RTX CORPORATION
- Current Assignee: RTX CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: CANTOR COLBURN LLP
- The original application number of the division: US14903844
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/16 ; B23K20/02 ; B23K35/36 ; B32B15/01 ; B23K20/233 ; B23K103/16 ; B23K101/00 ; B23K103/00 ; B23K101/34 ; B23K103/18

Abstract:
A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.
Public/Granted literature
- US20210178511A1 TRANSIENT LIQUID PHASE BONDING OF SURFACE COATINGS AND METAL-COVERED MATERIALS Public/Granted day:2021-06-17
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