Invention Grant
- Patent Title: Power supply device mounting structure
-
Application No.: US17200306Application Date: 2021-03-12
-
Publication No.: US11897542B2Publication Date: 2024-02-13
- Inventor: Kazuya Nakano , Kazuto Yamane , Masaki Takahashi
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: JP 20046432 2020.03.17
- Main IPC: B60K1/04
- IPC: B60K1/04 ; B62D21/15

Abstract:
A power supply device mounting structure for a power supply device disposed below a seat disposed in a vehicle interior is provided. The power supply device mounting structure includes a plate member and a contact portion. The plate member is disposed between the power supply device and a seat surface portion of the seat and the plate member covers an upper surface of the power supply device. The contact portion is provided at a position facing an edge portion of the plate member and the contact portion comes into contact with the seat surface portion when a load is input from the seat surface portion.
Public/Granted literature
- US20210291905A1 POWER SUPPLY DEVICE MOUNTING STRUCTURE Public/Granted day:2021-09-23
Information query
IPC分类: