Invention Grant
- Patent Title: Pressurized structure panel and cylinder
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Application No.: US17861550Application Date: 2022-07-11
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Publication No.: US11897638B2Publication Date: 2024-02-13
- Inventor: Hiromichi Akiyama , Naoto Azusawa , Yutaka Terada
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 21115987 2021.07.13
- Main IPC: B64G1/54
- IPC: B64G1/54 ; B64G1/56

Abstract:
A pressurized structure panel for forming a pressurized space pressurized inside includes a panel structure having a panel body to receive the pressure, a rib provided in the panel body, and a hollow part formed by the panel body and the rib, a radiation shielding material provided in the hollow part, and a debris bumper provided outside the panel structure and provided spaced apart from the panel structure by a certain spacing. The radiation shielding material includes a material containing hydrogen atoms in molecules.
Public/Granted literature
- US20230020582A1 PRESSURIZED STRUCTURE PANEL AND CYLINDER Public/Granted day:2023-01-19
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