Invention Grant
- Patent Title: Workpiece processing method
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Application No.: US17238237Application Date: 2021-04-23
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Publication No.: US11897705B2Publication Date: 2024-02-13
- Inventor: Takao Miyazawa , Mitsuhiro Yamamura , Noboru Asauchi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agent Yu Gang
- Priority: JP 20077535 2020.04.24
- Main IPC: B65G47/90
- IPC: B65G47/90 ; B23Q5/22

Abstract:
A workpiece processing method includes a carry-in step of carrying a workpiece into the field of view of a magnifier, a work step of performing predetermined work on the workpiece based on an image provided via the magnifier, and a carry-out step of carrying the workpiece out of the field of view of the magnifier. A robot performs at least one of the carry-in step and the carry-out step as well as the work step.
Public/Granted literature
- US20210331874A1 WORKPIECE PROCESSING METHOD Public/Granted day:2021-10-28
Information query
IPC分类: