Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US17832904Application Date: 2022-06-06
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Publication No.: US11897761B2Publication Date: 2024-02-13
- Inventor: Ki Yeul Yang , Kyung Han Ryu , Seok Hun Yun , Bora Baloglu , Hyun Cho , Ramakanth Alapati
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Valley Point
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Kevin B. Jackson
- The original application number of the division: US16448901 2019.06.21
- Main IPC: B81C1/00
- IPC: B81C1/00 ; H01L23/48 ; B81B7/00

Abstract:
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
Public/Granted literature
- US20220298008A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2022-09-22
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