Invention Grant
- Patent Title: Measuring device and method of obtaining thickness of sheath
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Application No.: US17356230Application Date: 2021-06-23
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Publication No.: US11898840B2Publication Date: 2024-02-13
- Inventor: Shinji Kubota
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 20107803 2020.06.23
- Main IPC: G01B7/06
- IPC: G01B7/06 ; H01J37/32

Abstract:
A measuring device includes a substrate disposed on a substrate support of a plasma processing apparatus, a transmission circuit, a transmitting antenna, a receiving antenna, a reception demodulation circuit, and a calculator which are provided in the substrate. The transmission circuit generates a microwave. The transmitting antenna transmits the microwave generated by the transmission circuit as a transmission wave. The receiving antenna receives a reflected wave of the transmission wave by plasma above the substrate support as at least one reception wave. The reception demodulation circuit generates a signal that reflects a thickness of a sheath between the substrate and the plasma, from the reception wave. The calculator obtains the thickness of the sheath from the signal generated by the reception demodulation circuit.
Public/Granted literature
- US20210396506A1 MEASURING DEVICE AND METHOD OF OBTAINING THICKNESS OF SHEATH Public/Granted day:2021-12-23
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