- Patent Title: Micromachined multi-axis gyroscopes with reduced stress sensitivity
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Application No.: US17444723Application Date: 2021-08-09
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Publication No.: US11898845B2Publication Date: 2024-02-13
- Inventor: Cenk Acar , Brenton Simon , Sandipan Maity
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Brake Hughes Bellermann LLP
- Main IPC: G01C19/5712
- IPC: G01C19/5712 ; G01C19/5656 ; B81C1/00 ; B81B3/00

Abstract:
In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.
Public/Granted literature
- US20210372795A1 MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY Public/Granted day:2021-12-02
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