Invention Grant
- Patent Title: Sensor-cluster apparatus
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Application No.: US17885504Application Date: 2022-08-10
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Publication No.: US11898879B2Publication Date: 2024-02-13
- Inventor: Jun Su Chun , Hee Chang Roh
- Applicant: HYUNDAI MOBIS CO., LTD.
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR 20190134011 2019.10.25
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01S13/86 ; G01S13/931 ; G01S13/00

Abstract:
A sensor-cluster apparatus includes: sensors configured to detect and collect external environment information, the sensors including one or more kinds of sensors; a body member having one surface onto which the sensors are mounted; a case on which the body member is fixed, the case including: an inner space in which the body member is mounted; and an opening defined in one surface thereof exposing the inner space, the sensors are exposed through the opening; and a cover configured to open and close the opening of the case, wherein, the sensors are configured to be detached from the body member through the opening of the case with the body member fixed to the case.
Public/Granted literature
- US20220381591A1 SENSOR-CLUSTER APPARATUS Public/Granted day:2022-12-01
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