Invention Grant
- Patent Title: Electronic device including adhesive portion
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Application No.: US17728209Application Date: 2022-04-25
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Publication No.: US11899503B2Publication Date: 2024-02-13
- Inventor: Hoang Nguyen Van , Tri Bui Dac , Dieu Le Hoang , Thang Ngo Van , Trung Nguyen Duc
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR 20190171917 2019.12.20
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
An electronic device is provided. The electronic device includes a first housing, a second housing coupled to the first housing, a plurality of first adhesive portions arranged between the first housing and the second housing, and spaced apart from each other along a first perimeter portion of the first housing, and a plurality of second adhesive portions arranged between the plurality of first adhesive portions and arranged along a second perimeter portion of the first housing, wherein the first adhesive portions include an adhesive support portion extending in one direction and a first adhesive material arranged on one side or both sides of the adhesive support portion, and the second adhesive portions include a second adhesive material.
Public/Granted literature
- US20220253107A1 ELECTRONIC DEVICE INCLUDING ADHESIVE PORTION Public/Granted day:2022-08-11
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