Invention Grant
- Patent Title: Circuitry for high-bandwidth, low-latency machine learning
-
Application No.: US17560950Application Date: 2021-12-23
-
Publication No.: US11899746B2Publication Date: 2024-02-13
- Inventor: Martin Langhammer , Andrei-Mihai Hagiescu-Miriste
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder, P.C.
- Main IPC: G06F17/16
- IPC: G06F17/16 ; G06N5/00 ; G06N3/063

Abstract:
The present disclosure relates generally to techniques for efficiently performing operations associated with artificial intelligence (AI), machine learning (ML), and/or deep learning (DL) applications, such as training and/or interference calculations, using an integrated circuit device. More specifically, the present disclosure relates to an integrated circuit design implemented to perform these operations with low latency and/or a high bandwidth of data. For example, embodiments of a computationally dense digital signal processing (DSP) circuitry, implemented to efficiently perform one or more arithmetic operations (e.g., a dot-product) on an input are disclosed. Moreover, embodiments described herein may relate to layout, design, and data scheduling of a processing element array implemented to compute matrix multiplications (e.g., systolic array multiplication).
Public/Granted literature
- US20220114236A1 CIRCUITRY FOR HIGH-BANDWIDTH, LOW-LATENCY MACHINE LEARNING Public/Granted day:2022-04-14
Information query