A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.