Invention Grant
- Patent Title: Sensor assembly for a resistance temperature sensor element and resistance temperature sensor element
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Application No.: US17737135Application Date: 2022-05-05
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Publication No.: US11901099B2Publication Date: 2024-02-13
- Inventor: Stefan Andreas Roessinger , Horst Sirtl
- Applicant: TE Connectivity Sensors Germany GmbH
- Applicant Address: DE Dortmund
- Assignee: TE Connectivity Sensors Germany GmbH
- Current Assignee: TE Connectivity Sensors Germany GmbH
- Current Assignee Address: DE Dortmund
- Agency: Barley Snyder
- Priority: EP 172548 2021.05.06
- Main IPC: H01C1/01
- IPC: H01C1/01 ; H01C7/00

Abstract:
A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.
Public/Granted literature
- US20220359106A1 SENSOR ASSEMBLY FOR A RESISTANCE TEMPERATURE SENSOR ELEMENT AND RESISTANCE TEMPERATURE SENSOR ELEMENT Public/Granted day:2022-11-10
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