Invention Grant
- Patent Title: Dielectric composition and multilayer capacitor
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Application No.: US17474510Application Date: 2021-09-14
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Publication No.: US11901127B2Publication Date: 2024-02-13
- Inventor: Jae Sung Park , Jeong Yun Park , Hyoung Uk Kim , Jong Han Kim , Chung Eun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200169870 2020.12.07
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; C04B35/468 ; H01G4/248

Abstract:
A dielectric composition and a multilayer capacitor including the same are provided. The dielectric composition includes a BaTiO3-base main component, a first subcomponent including an Nb component and a Gd component, a second subcomponent including an Mg component, and a third subcomponent including a Ba component and a Ca component. The first subcomponent is included in an amount of 4 moles or less per 100 moles of the main component. In the first subcomponent, a molar content of Nb and a molar content of Gd satisfy 0.33≤Nb/Gd, and in the third subcomponent, a molar content of Ba and a molar content of Ca satisfy 0.2≤Ca/(Ba+Ca).
Public/Granted literature
- US20220181081A1 DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR Public/Granted day:2022-06-09
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