Invention Grant
- Patent Title: Substrate chuck for self-assembling semiconductor light emitting diodes
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Application No.: US16857818Application Date: 2020-04-24
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Publication No.: US11901208B2Publication Date: 2024-02-13
- Inventor: Inbum Yang , Imdeok Jung , Junghun Rho , Bongwoon Choi
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch. Stewart, Kolasch & Birch, LLP
- Priority: KR 20190115574 2019.09.19 KR 20200008857 2020.01.22
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/50 ; H01L21/67 ; H01L25/075 ; H01L33/00 ; H05K13/04 ; H05K13/02 ; H01L21/60

Abstract:
Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.
Public/Granted literature
- US20210090929A1 SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES Public/Granted day:2021-03-25
Information query
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