Invention Grant
- Patent Title: Insulating component, semiconductor package, and semiconductor apparatus
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Application No.: US17722529Application Date: 2022-04-18
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Publication No.: US11901247B2Publication Date: 2024-02-13
- Inventor: Masami Juta , Daisuke Sakumoto
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 17031899 2017.02.23
- Main IPC: H01L23/047
- IPC: H01L23/047 ; H01L23/10 ; H01S5/02216 ; H01L23/498 ; H01S5/02251 ; H01L23/66 ; H01L31/0203 ; H01L31/02

Abstract:
An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.
Public/Granted literature
- US20220238400A1 INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPARATUS Public/Granted day:2022-07-28
Information query
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