Invention Grant
- Patent Title: Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package
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Application No.: US16701251Application Date: 2019-12-03
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Publication No.: US11901257B2Publication Date: 2024-02-13
- Inventor: Thomas Stoek , Michael Stadler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2018130936.8 2018.12.05
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/495 ; H01L21/56 ; H01L23/373 ; H01L23/31 ; H01L21/48 ; H01L23/498
Abstract:
A semiconductor package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, and a metal sheet having a first sheet surface and an opposite second sheet surface. The first sheet surface is exposed at the encapsulation body. The semiconductor chip is arranged at the second sheet surface. The first sheet surface has a pattern having first subdivisions having a first average roughness and second subdivisions having a second average roughness. The first average roughness is greater than the second average roughness.
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