Invention Grant
- Patent Title: Electronic IC device comprising integrated optical and electronic circuit component and fabrication method
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Application No.: US18095629Application Date: 2023-01-11
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Publication No.: US11901278B2Publication Date: 2024-02-13
- Inventor: Jean-Pierre Carrere , Francois Guyader
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Agency: Crowe & Dunlevy
- Priority: FR 09937 2019.09.10
- The original application number of the division: US17015634 2020.09.09
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L21/48 ; H01L31/02

Abstract:
A first circuit structure of an electronic IC device includes comprises light-sensitive optical circuit components. A second circuit structure of the electronic IC device includes an electronic circuit component and an electrically-conductive layer extending between and at a distance from the optical circuit components and the electronic circuit component. Electrical connections link the optical circuit components and the electronic circuit component. These electrical connections are formed in holes which pass through dielectric layers and the intermediate conductive layer. Electrical insulation rings between the electrical connections and the conductive layer are provided which surround the electrical connections and have a thickness equal to a thickness of the conductive layer.
Public/Granted literature
Information query
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