Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US18053957Application Date: 2022-11-09
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Publication No.: US11901306B2Publication Date: 2024-02-13
- Inventor: Chung-Yu Lu , Yao-Jen Chang , Sao-Ling Chiu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- The original application number of the division: US16548341 2019.08.22
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/308 ; H01L21/027

Abstract:
Semiconductor structures are provided. A semiconductor structure includes a plurality of product regions over a semiconductor substrate, a plurality of alignment regions over the semiconductor substrate, and a plurality of first features formed in a material layer over the semiconductor substrate. Each of the alignment regions is surrounded by four of the product regions of a group, and each of the first features extends across two adjacent product regions in the group. The product regions are disposed in rows and columns of a first array, and the alignment regions are disposed in rows and columns of a second array, and the first and second arrays have a same center point.
Public/Granted literature
- US20230112229A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2023-04-13
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