Invention Grant
- Patent Title: Semiconductor device package assemblies with direct leadframe attachment
-
Application No.: US16680795Application Date: 2019-11-12
-
Publication No.: US11901309B2Publication Date: 2024-02-13
- Inventor: Seungwon Im , Oseob Jeon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L21/48
Abstract:
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive.
Public/Granted literature
- US20210143107A1 SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE Public/Granted day:2021-05-13
Information query
IPC分类:
