Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17340930Application Date: 2021-06-07
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Publication No.: US11901332B2Publication Date: 2024-02-13
- Inventor: Yeong Beom Ko , Jin Han Kim , Dong Jin Kim , Do Hyung Kim , Glenn Rinne
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR 20140108365 2014.08.20
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L25/00 ; H01L21/683 ; H01L21/311 ; H01L25/065 ; H01L23/498 ; H01L23/538 ; H01L21/56 ; H01L21/78 ; H01L23/31
Abstract:
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
Public/Granted literature
- US20210366871A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-11-25
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